Ultrashort-pulsed lasers are also suited for the processing of electronic parts for example the creation of vias with high aspect ratio and diameters <50µm or cavities for microchips. Furthermore assembled and unassembled parts can be cut and separated and the PCB can be structured. Ceramics and Wafers can be split either via scribing and breaking or via direct laser cutting. Even single layers of electronic parts like LEDs can be removed using laser ablation.
For a complete system a 2-axis-galvo with controller and software as well as optic components for collimating and focusing the beam.
All usable components beside the laser source are shown in the matrix below.
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